Driving module

ABSTRACT

A driving module is provided, including: a fixed portion; a movable portion movably connected to the fixed portion and used to hold an optical element having an optical axis; a driving assembly disposed on the fixed portion or the movable portion for moving the movable portion relative to the fixed portion; and a circuit assembly electrically connected to the driving assembly and including a first segment and a second segment, wherein the first segment is positioned on a first plane, the second segment is positioned on a second plane, the first plane and the second plane are parallel to the optical axis, and the first plane and the second plane are different.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation Application of U.S. patentapplication Ser. No. 15/868,508, filed Jan. 11, 2018 and entitled“SUPPORT MECHANISM”, which claims priority of U.S. Provisional PatentApplication No. 62/450,198, filed on Jan. 25, 2017, and China PatentApplication No. 201711116584.9 filed on Nov. 13, 2017, which areincorporated by reference herein in their entirety.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a support mechanism, and especially toa support mechanism for holding a lens.

Description of the Related Art

Conventional cameras, video recorders and mobile phones can oftencollide with other objects or be otherwise impacted by external forces.As a result, the inner optical system of such a device may vibrate,resulting in the image that is captured coming out blurry. Patentdocument TW 1578094 discloses an optical image stabilization device,wherein its inner coil may interact with a corresponding magnet afterpassing a current, which allows the lens holder secured to the coil tomove along the optical axis of the lens and along a horizontal directionthat is perpendicular to the direction of the optical axis. Thisachieves auto focus (AF) and optical image stabilization (OIS)functionality, and can lead to better image quality. As shown in FIG. 1,in a conventional optical image stabilization device, a lens is disposedin a lens holder 100, the lens holder 100 is movably disposed in theframe 200, wherein the frame 200 and the substrate 300 below the frame200 extend along a vertical direction (Z axis direction) and areconnected by a resilient suspension wire 400. However, this may make ithard to reduce the dimensions of the mechanism along the Z axis, whichis a disadvantage to the goal of miniaturizing such products.

BRIEF SUMMARY OF THE INVENTION

To overcome these problems, an optical mechanism is provided in thisinvention. The optical mechanism includes a fixed member, a movablemember, an optical element, a first sensing magnet and a first sensingelement. The movable member is movably connected to the fixed member,and the optical element is disposed on the movable member. The firstsensing magnet corresponds to the optical element and has a firstmagnetic polar direction. The first sensing element corresponds to thefirst sensing magnet for detecting the rotation of the first sensingmagnet around a first axis direction relative to the fixed member,wherein the first axis is perpendicular to the first magnetic polardirection.

In an embodiment, the resilient element includes a first connectingsurface and a second connecting surface, the first connecting surface isfixed on the outer surface of the movable module, and the secondconnecting surface is fixed on the inner surface of the fixed module.

In an embodiment, the first connecting surface and the second connectingsurface are not perpendicular to an optical axis of the lens.

In an embodiment, the resilient element further includes two secondconnecting surfaces, and the first connecting surface is between thesecond connecting surfaces.

In an embodiment, the first connecting surface is fixed on the centerposition of the outer surface of the movable module.

In an embodiment, the resilient element further includes two firstconnecting surfaces, and the second connecting surface is between thefirst connecting surfaces.

In an embodiment, the first connecting surfaces are fixed on twoopposite ends of the outer surface of the movable module.

In an embodiment, the resilient element is longitudinal and has aU-shaped structure connecting the movable module or the fixed module.

In an embodiment, the support mechanism further includes two resilientelements connecting different sides of the movable nodule, and theresilient elements are perpendicular to each other.

In an embodiment, the support mechanism further includes a springconnecting the movable module and the fixed module, and the resilientelement includes a bent portion electrically connected to the spring.

In an embodiment, the support mechanism further includes a circuit unit,and the fixed module comprises a conductive element electricallyconnecting to the resilient element and the circuit unit.

In an embodiment, the resilient element includes a spring sheet.

The present invention further provides a support mechanism for movablysupporting a lens, including a fixed module, a movable module, a lensholder and a resilient element. The movable module is movably disposedin the fixed module, wherein the movable module has a substantiallyquadrilateral structure. The lens holder is movably disposed in themovable module for holding the lens. The resilient element is connectedto an outer surface of the movable module and an inner surface of thefixed module, wherein the outer surface of the movable module is at acorner of the quadrilateral structure.

In an embodiment, the resilient element includes a first connectingsurface and a second connecting surface, the first connecting surface isfixed on the outer surface of the movable module, and the secondconnecting surface is fixed on the inner surface of the fixed module,wherein the first connecting surface is not parallel to the secondconnecting surface.

In an embodiment, the resilient element further includes two secondconnecting surfaces, and the first connecting surface is between thesecond connecting surfaces.

In an embodiment, the resilient element includes a circular structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a conventional support mechanism.

FIG. 2A is an exploded view of a support mechanism, according to anembodiment of the present invention.

FIG. 2B is a cross-sectional view of the support mechanism in FIG. 2Aafter combining.

FIG. 2C is a top view of the support mechanism in FIG. 1 after combiningand removing the case.

FIG. 2D is an enlarged view of the marked portion A in FIG. 2C.

FIG. 3 is a schematic view of the resilient element in FIG. 2A.

FIG. 4 is a schematic view of the resilient element electricallyconnecting to the spring, according to an embodiment of the presentinvention.

FIG. 5 is a schematic view of the resilient element connecting to thefixed module and the movable module, according to an embodiment of thepresent invention.

FIG. 6 is a schematic view of the resilient element connecting to thefixed module and the movable module, according to another embodiment ofthe present invention.

FIG. 7 is a schematic view of the resilient element connecting to thefixed module and the movable module, according to another embodiment ofthe present invention.

FIG. 8 is a schematic view of the resilient element connecting to thefixed module and the movable module, according to another embodiment ofthe present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, the embodiment of present invention will be describedhereinafter with attached figures.

The abovementioned and other technical contents, features and effectsrelating to the present invention are clearly shown in the descriptionof a preferred embodiment with reference figures. The directionalphrases, such as on, under, left, right, front or rear are thedirections relative to the reference figures. As a result, thedirectional phrases are only for illustration and is not intended torestrict this invention.

Referring to FIGS. 2A-2C. In an embodiment of the present invention, alens support mechanism 1 may be disposed, for example, in a camera (oran electronic device with photographing function) to hold a lens, and itmay be used to prevent or to suppress the problem of the image capturedblurring caused from the camera vibration. It can be figured out fromFIGS. 2A-2C that the support mechanism 1 mainly includes a case 12, atleast a conductive element 14, a frame 22, at least a magnetic element24, a lens holder 30, at least a resilient element 40, a first spring50, a second spring 52, a first driving mechanism 60, a second drivingmechanism 62, a circuit unit 70 and a base 72, wherein the case 12 andthe conductive element 14 are fixed to each other to form a fixed module10, and the frame 22 and the magnetic element 24 form a movable nodule20 which may move relative to the fixed module 10. It should be notedthat an image sensor (e.g. CCD, not shown) is disposed under the base27, and a lens (not shown) corresponding to the image sensor is disposedin the lens holder 30. Coils corresponding to the magnetic elements 24are disposed in the second driving element 62 to move the lens holder 30and the lens therein by magnetic force to instantly correct the offsetof the lens along X axis direction or Y axis direction, and thusachieving optical image stabilization and acquiring better imagequality. Furthermore, the magnetic elements 24 may be shielded by otherelements when viewed from top in this embodiment, so they are not shownin FIG. 2C.

As shown in FIGS. 2B-2C, the movable module 20 is movably disposed inthe fixed module 10, and the lens holder 30 is movably disposed in themovable module 20 for holding the lens. It can be figured out from FIGS.2C-2D that the resilient elements 40 at left and right sides arerespectively connected to the outer surface S1 of the frame 22 and theinner surface S21 of the conductive element 14 along Y axis, and theouter surface S1 faces the inner surface S21. Furthermore, the resilientelements 40 at top and bottom sides are respectively connected to theouter surface S1 of the frame 22 and the inner surface S21 of theconductive element 14 along X axis. In other words, the resilientelements 40 only have to be connected to any outer surface of themovable module 20 (frame 22 or magnetic element 24) and any innersurface of the fixed module 10 (case 12 or conductive element 14), andis not limited by the embodiments of FIGS. 2B-2D. In this embodiment,the resilient element 40 is connected to the fixed module 10 and themovable module 20 to move the lens holder 30 and the lens disposedtherein along the horizontal direction (i.e. X axis direction or Y axisdirection) relative to the case 12 and the base 72 to perform opticalimage stabilization. No suspension wire is required to be disposed inthis embodiment, so the height of the image capturing module along Zaxis may be significantly reduced to meet the requirement ofminiaturization of the electronic devices.

FIG. 3 is a schematic view of the resilient element 40 in FIG. 2A. Theresilient element 40 includes a first connecting surface 42 and at leasta second connecting surface 44, wherein the first connecting surface 42may be fixed on the outer surface S1 of the the second connectingsurface 44 may be fixed on the inner surface S2 of the fixed module 10the inner surface of the case 12 or the conductive element 14), and thefirst connecting surface 42 and the second connecting surface 44 are notperpendicular to optical axis O. In an embodiment, the first connectingsurface 42 and the second connecting surface 44 are parallel to theoptical axis O, but is not limited thereto. In this embodiment, theresilient element 40 is connected to the fixed module 10 and the movablemodule 20 in a surface contact manner, the connecting method may bewelding or adhesion, but is not limited thereto. As a result, themovable module 20 may move along the horizontal direction (i.e. X axisdirection or Y axis direction) relative to the fixed module 10 toperform the horizontal offset correction of the lens along X axis and Yaxis directions. In this embodiment, the resilient element 40 is used asthe connecting structure, wherein conventional connecting way is usingsuspension wire, so the lens may have less chance to tilt with respectto the Z axis direction.

Still referring to FIG. 3, the resilient element 40 substantially has anlongitudinal shape and forms a U-shaped structure 46. The U-shapedstructure 46 may increase contact area between the resilient element 40and the fixed module 10/the movable module 20 to enhance the stabilityof the support mechanism 1. In an embodiment, the resilient element 40may be a spring sheet and may be formed by metal sheet stamping, but isnot limited thereto.

Referring to FIGS. 2A-2C and 4, the circuit unit 70 may provide currentto the first driving element 60 and the second driving element 62 toperform auto focus and optical image stabilization functions, whereinthe resilient element 40 may be electrically connected to the circuitunit 70 through the conductive element 14. As shown in FIG. 4, theresilient element 40 includes a bent portion 48 extended upward fromsidewall of the frame 22 and bent toward the inner side of the frame 22,and thus electrically connects to a top surface of the first spring 50.As a result, the contact area of the resilient element 40 and the firstspring 50 may be increased, so their bonding strength may be enhanced.

Referring to FIG. 5, which is a schematic view of the connection of theresilient element 40 and the fixed module 10 the case 12 or conductiveelement 14 in FIG. 2B) and the movable module 20 (e.g. the frame 22 ormagnetic element 24 in FIG. 2B), wherein the lens holder 30 is movablydisposed in the movable module 20 for holding the lens. In thisembodiment, the four resilient elements 40 are respectively connected todifferent sides of the fixed module 10 and the movable module 20.Furthermore, it can be figured out from FIG. 5 that the resilientelement 40 includes a plurality of second connecting surfaces 44,wherein the first connecting surface 42 is between the second connectingsurfaces 44, the first connecting surface 42 is connected to the centerposition of the outer surface S1 of the movable module 20, and thesecond connecting surface 44 is connected to the inner surface S2 of thefixed module 10. It should be noted that only two resilient elements 40are respectively connected to the fixed module 10 and the movable module20 in some embodiments, wherein the two resilient elements 40 arerespectively at different sides of the movable module 20 andperpendicular to each other, but is not limited thereto.

However, different types of resilient elements 40 may be used to connectthe movable module 20 (e.g. the frame 22 or the magnetic element 24 inFIG. 2B) and the fixed module 10 (e.g. the case 12 or the conductiveelement 14 in FIG. 2B). As shown in FIG. 6, the resilient element 40 hasa plurality of the first connecting surfaces 42 in this embodiment,wherein the second connecting surface 44 is between the two firstconnecting surfaces 42, each of the first connecting surface 42 of theresilient element 40 is connected to two opposite ends of the outersurface S1 of the movable module 20, and the second connecting surfaces44 are connected to the inner surface S2 of the fixed module 10. In thisembodiment, the movable module 20 and the fixed module 10 are connectedby the resilient element 40, so no suspension wire is required, and thusthe thickness of the image capturing module is reduced to meet therequirement of miniaturization of the electronic devices.

Referring to FIG. 7, which is a schematic view of the connection betweenthe resilient element 40 and the fixed module 10 (e.g. the case 12 orconductive element 14 in FIG. 2B) and the movable module 20 (e.g. theframe 22 or magnetic element 24 in FIG. 2B), according to anotherembodiment of the present invention. The movable module 20 is movablydisposed in the fixed module 10, wherein the movable module 20substantially has a quadrilateral structure, and the lens holder 30 ismovably disposed in the movable module 20 for holding a lens. It can befigured out from FIG. 7 that the resilient element 40 is connected to anouter surface S1 of the movable module 20 and an inner surface S2 of thefixed module 10, wherein the outer surface S1 is at a corner of thequadrilateral structure. In this embodiment, the resilient element 40 isdisposed at the corner of the movable module 20, so the space at thecorner of the movable module 20 may be fully utilized to miniature thevolume of the image capturing module.

Referring to FIG. 7, the resilient element 40 includes a firstconnecting surface 42 and a plurality of second connecting surfaces 44,wherein the first connecting surface 42 is fixed on the outer surface S1of the movable module 20, and the second connecting surfaces are fixedon the inner surface S2 of the fixed module 10. It should be noted thatthe first connecting surface 42 is not parallel to the second connectingsurfaces 44, and the first connecting surface 42 is between the secondconnecting surfaces 44.

On the other hand, as shown in FIG. 8, the resilient element 40 may alsohas a circular structure to connect the movable module 20 (e.g. theframe 22 or the magnetic element 24 in FIG. 2B) with the fixed module 10(e.g. the case 12 or the conductive element 14 in FIG. 2B), wherein thelens holder 30 is movably disposed in the movable module 20 for holdinga lens. As a result, the lens may move along the horizontal direction (Xaxis direction or Y axis direction) relative to the fixed module 10.

In every embodiment of the present invention, the movable module 20 andthe fixed module 10 are connected by the resilient element 40, so aconventional suspension wire is not required. As a result, it is harderto tilt the lens with respect to the Z axis direction, and the height ofthe image capturing module along the Z axis may be significantlyreduced, meeting the requirement to miniaturize the electronic device.

The descriptions above are only embodiments of the present thedisclosure, and should not be used to limit the present disclosure. Fora person skilled in the art, various changes and variations may beincluded in the present disclosure. The features of the embodiments maybe used together and depend on the requirements, and is not limited. Anyvariation, equivalent replacement and improvement in the spirit andprinciple of the present disclosure should be protected in the presentdisclosure.

What is claimed is:
 1. A driving module, comprising: a fixed portion; amovable portion movably connected to the fixed portion and used to holdan optical element having an optical axis; a driving assembly disposedon the fixed portion or the movable portion for driving the movableportion to move relative to the fixed portion; and a circuit assemblyelectrically connected to the driving assembly, wherein the circuitassembly comprises a first segment which is plate-shaped, the firstsegment is parallel to the optical axis, and at least a portion of thefirst segment overlaps the movable portion when viewed in a directionthat is perpendicular to the optical axis.
 2. The driving module asclaimed in claim 1, wherein the circuit assembly further comprises asecond segment, wherein the first segment is positioned at a firstvirtual plane, the second segment is positioned at a second virtualplane, the first virtual plane and the second virtual plane are parallelto the optical axis, and the first virtual plane and the second virtualplane are different and have a distance greater than zero.
 3. Thedriving module as claimed in claim 2, wherein the first segment and thesecond segment are positioned at a side of the fixed portion when viewedalong the optical axis.
 4. The driving module as claimed in claim 3,wherein a shortest distance between the first segment and the movableportion is greater than a shortest distance between the second segmentand the movable portion when viewed along the optical axis.
 5. Thedriving module as claimed in claim 4, wherein the second segment ispositioned between the first segment and the optical axis when viewedalong the optical axis.
 6. The driving module as claimed in claim 1,wherein the circuit assembly further comprises a connecting segment, andthe first segment and the second segment are connected by the connectingsegment.
 7. The driving module as claimed in claim 6, wherein the firstsegment, the second segment and the connecting segment extend todifferent directions.
 8. The driving module as claimed in claim 6,wherein the first segment and the second segment extend to an identicaldirection, and the connecting segment extends to another directiondifferent from the first segment and the second segment.
 9. The drivingmodule as claimed in claim 6, wherein an angle between the first segmentand the connecting segment is substantially identical to an anglebetween the second segment and the connecting segment.
 10. The drivingmodule as claimed in claim 6, wherein an angle between the first segmentand the connecting segment is greater than an angle between the secondsegment and the connecting segment.
 11. The driving module as claimed inclaim 6, wherein the connecting segment has a curved structure.
 12. Thedriving module as claimed in claim 1, wherein the circuit assembly ismovably connected to the movable portion and the fixed portion.
 13. Thedriving module as claimed in claim 12, wherein the first segment isconnected to the fixed portion, and the second segment is connected tothe movable portion.
 14. The driving module as claimed in claim 13,wherein the first virtual plane is not parallel to the second virtualplane.
 15. The driving module as claimed in claim 14, wherein the firstsegment and the second segment extend to different directions.
 16. Thedriving module as claimed in claim 1, wherein the second segmentcomprises two sub-segments extend to an identical direction, and a gapis formed between the two sub-segments.
 17. The driving module asclaimed in claim 1, further comprising another circuit assemblyelectrically connected to the driving assembly and comprising a thirdsegment and a fourth segment, wherein the third segment is positioned ona third virtual plane, the fourth segment is positioned on a fourthvirtual plane, the third virtual plane and the fourth virtual plane areparallel to the optical axis, and the third virtual plane and the fourthvirtual plane are different.
 18. The driving module as claimed in claim17, wherein the first segment and the third segment are connected to thefixed portion and extend to different directions.
 19. The driving moduleas claimed in claim 17, wherein the first segment and the third segmentare connected to the fixed portion, the second segment and the fourthsegment are connected to the movable portion, and the second segment andthe third segment extend to an identical direction.
 20. The drivingmodule as claimed in claim 17, wherein the first segment and the thirdsegment are connected to the fixed portion, and the first virtual planeis parallel to the third virtual plane.